Plating on Polyimide (PI) Film: Top SAPINA Process
Plating process for polyimide (PI) film for flexible printed circuit boards (FPC)! Ideal for fine circuit formation and via hole methods!
The advancement and miniaturization of electronic devices have led to a demand for further speed and density in printed circuit boards. Particularly, polyimide is widely used as a material for flexible printed circuits (FPC) due to its excellent heat resistance and dielectric properties. However, traditional methods have had limitations in the miniaturization of wiring. Therefore, Okuno Pharmaceutical Industry has developed an optimal process for fine wiring formation. ◆ Nickel seed layer formation process on polyimide (PI) film ◆ ~ Top SAPINA Process ~ What's amazing about it! - The entire process is achieved using a wet method. - Unlike dry methods (such as vapor deposition and sputtering), it does not require large and expensive equipment. - It realizes cost reduction. - Both sides can be processed at once. - High peel strength. - Ensures high adhesion. - Enables fine nickel/gold plating.
- Company：奥野製薬工業 大阪・放出、東京、名古屋など
- Price：Other
